RF生产能力 pcbprices.com

RF&MicroWave PCB
1	Number of Layers	1-10Layers
2	Max.Board Size	508*610mm
3	Min.Board Thickness	2-layer 0.1mm
		4-layer 0.4mm
		6-layer 0.6mm
		8-layer 0.8mm
		10-layer 1.0mm
4	Min Line Width/Space	4mil/4mil(0.1/0.1mm)
5	Min.S/M Pitch	0.1mm(4mil)
6	Finish Hole (Mechanical)	0.2mm--6.30mm
7	PTH Wall Thickness	>0.025mm(1mil)
8	Hole Dia.Tolerance(PTH)	±0.075mm(3mil)
9	Hole Dia.Tolerance(NPTH)	±0.05mm(2mil)
10	Hole Position Deviation	±0.05mm(2mil)
11	Outline Tolerance	±0.10mm(4mil)
12	Twist&Bow	≤0.7%
13	Insulation Resistance	>1012Ω Normal
14	Through hole resistance	<300Ω Normal
15	Electric strength	>1.3 kv/mm
16	Current breakdown	10A
17	Peel strength	1.4N/mm
18	S/M abrasion	>6H
19	Thermal stress	288℃ 20 Sec
20	Test Voltage	50-300V
21	Min. blind/buried via	0.2mm (8mil)
22	Available Laminates Material	Rogers,ARLON, NELTEC, ROGERS, TACONIC
23	Finished board thickness tolerance	T>=0.8mm,Tolerance:+/-8%,T<0.8mm,Tolerance:+/-10%
24	Out Layer Copper Thickness	1oz--5oz
25	Inner Layer Copper Thickness	1/2oz--4oz
26	Aspect Ratio	8:1
27	SMT Mini. Solder Mask Width	0.08mm
28	Mini. Solder Mask Clearance	0.05mm
29	Plug Hole Diameter	0.2mm--0.60mm
30	Impedance Control Tolerance	+/-10%
31	Surface Finish	HASL,HASL Leadfree,Immersion ENIG,Chem. Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver
32	Insulation Layer Thickness	0.075mm--5.00mm
33	Special technology	Impedance control PCB,Blind/Buried PCB,Hard gold PCB,Aluminum PCB

我们的服务: